OpenFive’s Idea-to-Silicon capabilities combined with our advanced design processes in 5nm, 7nm and 12nm processes and 2.5D packaging technology enable exciting new design applications such as artificial intelligence (AI), desktop computing, networking and high performance computing (HPC). OpenFive’s flexible business model allows us to partner with you across multiple organizational entry points. Expertise in building scalable, custom SoCs with advanced in-house design, integration and verification using automated tools and processes.

OpenFive, an Alphawave IP company – your proven path from custom SoC architecture to silicon and volume. OpenFive provides end-to-end expertise in architecture, IP integration, design integration, software, silicon support, and manufacturing to deliver high-quality silicon at nodes up to 5nm.

With diverse silicon design capabilities, standardized platforms, and IP diversity for SoCs for artificial intelligence, data center/high performance computing, networking, and security applications, OpenFive is positioned to well to deliver highly competitive, CPU-independent, domain-specific SoCs tailored for your applications. . OpenFive is a long-time participant in TSMC’s Value Chain Aggregator (VCA) program.

OpenFive offers a complete solution, from package selection, design and development, to mass production. We understand the importance of choosing the right packaging solution to meet the technical and cost constraints of each configuration. Our packaging capabilities include 2.5D technology, and OpenFive’s extensive experience allows us to meet the unique needs of each customer and deliver their products efficiently. 2.5D IC is a packaging technology where multiple chips are placed face-down and side-by-side on silicon or silicon. The active solar panel consists of small pads that connect to the pads on top of the silicon interposer. The connection of these pads is directly connected to the TSV (Through Silicon Vias), which passes through the interposer and connects to the package. The pad connections can be connected from the interposer to other TSVs that are connected to the pads and microbumps of other chips in the interposer. 2.5D IC technology helps to reduce the length of the connection between multiple modules and the interposer, resulting in a reduction in power consumption and latency as well as an increase in the number of connection paths in the interposer, resulting in an increase in bandwidth compared to custom off-2D. . connection breakdown.

The image above shows the rise of 2 or more silicon dies and an interposer die and combines all the processes into one package. 2.5D silicon-based technology is entering high-performance computers, graphics processors, and AI processors (intelligence) using high-bandwidth memories (HBMs). These HBMs are KGD tested (Known Good Die) and included in the interposer and chip with the main processing and control HBM. A high-density transfer through an interposer connects the two pages.

The main advantages of this technology are miniaturization, better performance, low latency, increased bandwidth and energy efficiency. The main advantage of the 2.5D technology is that the dies placed in the interposer do not need to use the same door or technology. It helps to use the sun produced in different types of technology. For example, the HBM 3D memory chip can be embedded in an interposer with a processor chip manufactured in 7nm process technology.

Open-Silicon Inc., an Alphawave IP company, is a legal entity operating under the OpenFive brand of ISO 9001:2015 certification “Design, manufacture and sale of ASICs using wafer operations, production, assembly and test.”

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